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Tuesday, January 2, 2024

MTK Dimensity Tier List (Messy Naming)

Updated on 2024/07/21.

Disclaimer: This list is base on Wikipedia data. The grouping solely depends on CPU architectuname and process node, CPU frequency and GPU are ignored. 

TSMC N4P, 4* Cortex X4 + 4* Cortex A720 (fastest SoC for phones now):

  • Dimensity 9300
TSMC N4P, 1* Cortex X3 + 3* Cortex A715 + 4* Cortex A510 (Comparable to Snapdragon 8 gen 2):
  • Dimensity 9200(+)

TSMC N4, 1* Cortex X2 + 3* Cortex A710 + 4* Cortex A510 (Comparable to Snapdragon 8+ gen 1):

  • Dimensity 9000(+)

TSMC N4P, 4* Cortex A715 + 4* Cortex A510 (Comparable to Snapdragon 8+ gen 1, slightly weaker ST performace):

  • Dimensity 8300

TSMC N4, 4* Cortex A78 + 4* Cortex A55 (Comparable to Snapdragon 7+ gen 2(which is downclocked 8+ gen 1, weaker ST performace):

  • Dimensity 8200

TSMC N5P, 4* Cortex A78 + 4* Cortex A55 (Comparable to Snapdragon 7+ gen 2(which is downclocked 8+ gen 1, weaker ST performace):

  • Dimensity 8100
  • Dimensity 8000

TSMC N4P, 2* Cortex A715 + 6* Cortex A510 (Low big core count but should be very efficient thanks to N4P):

  • Dimensity 7200
  • Dimensity 7350

TSMC N4, 4* Cortex A78 + 4* Cortex A55 (Performance comparable to Snapdragon 778G, but should be very efficient thanks to N4):

  • Dimensity 7300(X)

TSMC N6, 4* Cortex A78 + 4* Cortex A55 (Comparable to Snapdragon 778G):

  • Dimensity 8050 (1300 renamed)
  • Dimensity 8020 (1100 renamed)
  • Dimensity 1300
  • Dimensity 1200
  • Dimensity 1100

TSMC N6, 2* Cortex A78 + 6* Cortex A55 (Comparable to Snapdragon 695):

  • Dimensity 7050 (1080 renamed)
  • Dimensity 7030 (1050 renamed)
  • Dimensity 7020 (930 renamed)
  • Dimensity 1080
  • Dimensity 1050
  • Dimensity 930
  • Dimensity 920
  • Dimensity 900

TSMC N7, 4* Cortex A77 + 4* Cortex A55 (Comparable to Snapdragon 865):

  • Dimensity 1000(+)
TSMC N7, 4* Cortex A76 + 4* Cortex A55 (Comparable to Snapdragon 855):
  • Dimensity 820
  • Dimensity 800
TSMC N6, 2* Cortex A76 + 6* Cortex A55 (Comparable to Snapdragon 765):
  • Dimensity 6080 (810 renamed)
  • Dimensity 6100+ (slower than 6080)
  • Dimensity 810
TSMC N7, 2* Cortex A76 + 6* Cortex A55 (Comparable to Snapdragon 765):
  • Dimensity 6020 (700 renamed)
  • Dimensity 800U
  • Dimensity 720
  • Dimensity 700
 
 
 
 
 

QMK, 1000Hz Polling, NKRO, eagar debounce

近排又砌咗隻鍵盤,順便研究埋點樣將佢嘅latency降到同其他電競鍵盤一樣。

雖然呢個group玩自組鍵盤已經係小眾,會自己flash firmware嘅只會更少,但希望呢個方法可以令人少個理由買手感相對差嘅電競鍵盤,試下自組鍵盤。
鍵盤嘅latency主要有3部分: matrix scanning, debouncing, USB polling.
Matrix scanning: 即係控制器掃描所有軸嘅速度,通常都少於1ms.
Debouncing: 機械軸係用2塊銅片做觸發,但銅片喺接觸嘅瞬間會喺0同1之間彈嚟彈去,需要一個delay去無視呢啲輸入。Cherry MX及同類通常都係5ms, 新嘅1億次壽命Cherry MX Hyperglide係1ms, 光軸係0.
USB polling: 用過Gaming mouse都應該識,1000Hz = 1ms, 125Hz = 8ms.
USB polling可以用呢個program試,重可以順便試埋key order嘅問題。
你可以試下同時撳2粒制(例如A, S),係1000Hz嘅話應該會見到delay係1-7之間嘅數,而且有時係AS, 有時係SA.
遺憾嘅係好多自組鍵盤出廠都係125Hz, 所以delay好多都係10ms左右,好在有好多有線自組鍵盤都用一個強大嘅firmware叫QMK,呢個firmware最大賣點係可以設定鍵盤唔同鍵嘅功能。
如果你肯自己compile firmware嘅話,就可以改USB polling rate做1000Hz, 用其他debouncing algorithm去隱藏嗰5ms嘅delay, 甚至自己寫C code都得。
然後喺qmk_firmware/keyboards入面搵返自己隻keyboard
喺config.h度加:
#define USB_POLLING_INTERVAL_MS 1
#define FORCE_NKRO
#define DEBOUNCE 5
再喺rules.mk度加:
DEBOUNCE_TYPE = sym_eager_pk
Compile完之後用QMK toolbox flash入隻鍵盤,咁你嘅delay應該就會係2ms左右。
有錯請指正,以上資料都係用一晚Google得嚟